Press Release

For Immediate Release

3D Engine Provider HI Corp Joins TI's OMAP Developer Network,
Exhibiting in TI Booth at 3GSM World Congress in Cannes

TOKYO (17, 2, 2003) - HI CORPORATION (Headquarters: Meguro-ku, Tokyo; Capital: 289,250,000 yen; President & CEO: Kazuo Kawabata; http://www.hicorp.co.jp; "HI"), which has a pioneering presence in mobile 3D graphics technology, and Texas Instruments (Headquarters: Dallas, Texas; "TI") announced that HI is exhibiting its 3D rendering engine in the TI booth (Hall 2, E19) at 3GSM World Congress (Cannes, France) on Feb. 18 and 19. As a member of TI's OMAP Developer Network, HI will offer its 3D engine, Mascot Capsule Engine Micro 3D Edition, to the great number of handset manufacturers that have chosen TI's OMAP processors for their mobile devices.
"HI's Mascot Capsule Engine Micro 3D Edition enables advanced and colorful 3D expression," said Paul Werp, worldwide director of marketing for TI's OMAP platform. "Combining HI's 3D engine on TI's OMAP platform, gives manufacturers a compelling solution to provide users with colorful rich 3D graphics expression."

The Mascot Capsule Engine Micro 3D Edition takes advantage of the high-performance, low-power OMAP processors to allow manufacturers to provide 3D drawing functions and graphics applications for cellular phones and PDAs. The 3D engine enables 3D graphic technology with abundant representational capabilities that is convenient to use and suits the needs of end users. In order to advance 3D graphics technology, the two companies plan to jointly engage in technical collaboration and worldwide marketing activities.

HI President & CEO Kazuo Kawabata expressed his enthusiasm, commenting, "Because Mascot Capsule Engine Micro 3D Edition is ready to run on TI's OMAP platform, which has a proven record of adoption worldwide, we expect that the penetration rate for 3D graphics functionality on mobile equipment to accelerate."

HI is a member of TI's OMAP Developer Network, a group of leading software developers porting advanced applications to TI's high performance, power-efficient OMAP processors. Handset manufacturers adopting OMAP devices enjoy the rapid deployment of compelling wireless applications - including streaming audio and video, multimedia messaging, gaming, security, speech recognition, location based services and mobile commerce - across all leading operating systems. Systems level integration services are also provided worldwide by independent OMAP Technology Centers. The OMAP platform has been selected by leading manufacturers, such as Nokia, Palm, NEC, Fujitsu, LG Electronics, Hewlett-Packard, Sendo, HTC, and many more for their 2.5 and 3G wireless devices. For more information, please visit: www.omap.com.